![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() ![]() BYV29F-600 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 — 7 March 2011 2 of 11 NXP Semiconductors BYV29F-600 Enhanced ultrafast power diode 2. Pinning information 3. Ordering information 4. Limiting values Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode SOD59 (TO-220AC) 2 A anode mb mb mounting base; cathode mb 12 A 001aaa020 K Table 3. Ordering information Type number Package Name Description Version BYV29F-600 TO-220AC plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59 Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VRRM repetitive peak reverse voltage - 600 V VRWM crest working reverse voltage - 600 V VR reverse voltage DC - 600 V IF(AV) average forward current square-wave pulse; δ = 0.5 ; Tmb ≤ 115 °C; see Figure 1; see Figure 2 -9A IFRM repetitive peak forward current square-wave pulse; δ = 0.5 ; tp = 25 μs; Tmb ≤ 115 °C -18A IFSM non-repetitive peak forward current tp = 10 ms; sine-wave pulse; Tj(init) =25°C; see Figure 3 -91A tp = 8.3 ms; sine-wave pulse; Tj(init) =25°C; see Figure 3 - 100 A Tstg storage temperature -40 150 °C Tj junction temperature - 150 °C |
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